Below you will find pages that utilize the taxonomy term “hybrid-bonding”
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Eliyan's $1B Valuation and GlobalFoundries' $300M Photonics Award Price the Interconnect Bottleneck
Three financings in one session, all pointed at the same physical problem. Eliyan raised a $145 million Series C at a $1 billion valuation to license technology and build physical chiplets that ease data transfer bottlenecks between AI dies. GlobalFoundries is set to receive $300 million in CHIPS Act funding to advance silicon photonics research aimed at more efficient AI data centers. ChipAgents raised a $60 million Series A2 led by B Capital, taking an expanded round to $134 million, to apply agents to chip design itself.